SC810 is chip semiconductor packaging in line cleaning machine. Use to clean flux and other contamination on Chip after soldering during chip packaging process. SC810 is design to in line clean lead frame, IGBT, IPM, IC modules chips.

SC820 is a semiconductor packaging in line cleaning system. Use to clean flux and other contamination on Chips after soldering during chip packaging process. SC820 is design to clean lead frame, IGBT, IPM, BGA,CSP chips.

SC620 is a semiconductor packaging in line deflux machine. SC620 is used to clean water-based flux and other contamination on Lead frame, FCBGA, FCCSP... after ball placement and soldering process during chip packaging.

SC610 is a semiconductor packaging in line cleaning machine. SC610 is used to clean water-based flux and other contamination on Lead frame, FCBGA, FCCSP... after ball placement and soldering process during chip packaging.

SME-6140 is an online, integrated, fully automatic PCBA cleaning machine. It is used for online cleaning of organic and inorganic contaminants such as residual rosin flux and non-cleanable flux on the surface of PCBA after SMT soldering and THT insertion processes. It is widely used in industries such as automotive electronics, military, aerospace, communication, medical, MiniLED, and smart instruments, and is suitable for centralized cleaning of large quantities of PCBA, taking into account both cleaning efficiency and cleaning effect.