SC820 is a semiconductor packaging in line cleaning system. Use to clean flux and other contamination on Chips after soldering during chip packaging process. SC820 is design to clean lead frame, IGBT, IPM, BGA,CSP chips.

1.Semiconductor chips in line clean in packaging process.
2.Spray clean to remove flux and other contamination.
3.Long chemical wash+ DI water rinse+ Hot air dry process.
4.Wash liquid and rinse DI water add/discharge automatically.
5.Wash liquid spray pressure can adjust for different chips.
6.High flow amount and high pressure liquid for precise FC packaging chips.
7.DI water resistivity monitoring system.
8.Air blow+ Hot air dry system.
9.PLC control system, English interface and friendly operation system.
10.304 stainless steel frame structure.
11.SMEMA lines to connect up and down stream equipment.
12.Wash liquid concentration real time monitoring system.

Item	SC820 SPEC
Net conveyor width	600mm
Net conveyor speed	100~150cm/min
Net conveyor height	900±50mm
Net conveyor direction	Left to Right
Product width size	600mm as max
Product height	100mm as max
Wash liquid tank capacity	300L
DI water capacity	30+120L
Filter precision	0.2um
DI water consumption	400~800L/H
Air vent amount	42m³/H
System control	PLC
Power/Air supply	380VAC,3P,50/60HZ,136KW/0.5Mpa，200L/Min
Resistivity range	0~18MΩ
Machine size	L6600*W1750*H1650mm
Machine weight	3500KG