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Semicon Packaging Clenaing Machine SC820
Brief Introduction
SC820 is a semiconductor packaging in line cleaning system. Use to clean flux and other contamination on Chips after soldering during chip packaging process. SC820 is design to clean lead frame, IGBT, IPM, BGA,CSP chips.
Machine Features
1.Semiconductor chips in line clean in packaging process.
2.Spray clean to remove flux and other contamination.
3.Long chemical wash+ DI water rinse+ Hot air dry process.
4.Wash liquid and rinse DI water add/discharge automatically.
5.Wash liquid spray pressure can adjust for different chips.
6.High flow amount and high pressure liquid for precise FC packaging chips.
7.DI water resistivity monitoring system.
8.Air blow+ Hot air dry system.
9.PLC control system, English interface and friendly operation system.
10.304 stainless steel frame structure.
11.SMEMA lines to connect up and down stream equipment.
12.Wash liquid concentration real time monitoring system.
Machine SPEC

Item

SC820 SPEC

Net conveyor width

600mm

Net conveyor speed

100~150cm/min

Net conveyor height

900±50mm

Net conveyor direction

Left to Right

Product width size

600mm as max

Product height

100mm as max

Wash liquid tank capacity

300L

DI water capacity

30+120L

Filter precision

0.2um

DI water consumption

400~800L/H

Air vent amount

42m³/H

System control

PLC

Power/Air supply

380VAC,3P,50/60HZ,136KW/0.5Mpa,200L/Min

Resistivity range

0~18MΩ

Machine size

L6600*W1750*H1650mm

Machine weight

3500KG

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Contact us
Phone number:
Dongguan: 0769-85649925
Suzhou: 0512-67662816
Email: shenghua@dgshenghua.com.cn
Website:www.dgshenghua.com.cn
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