SC610 is a semiconductor packaging in line cleaning machine. SC610 is used to clean water-based flux and other contamination on Lead frame, FCBGA, FCCSP... after ball placement and soldering process during chip packaging.

1.FCBGA/FCCSP Semi chips in line clean in packaging process.
2.Spray clean to remove water based flux and other contamination.
3.DI water wash+ DI water rinse+ Hot air dry process.
4.Wash and rinse DI water add/discharge automatically.
5.Wash liquid spray pressure can adjust for different chips.
6.High flow amount and high pressure water for precise FC packaging chips.
7.DI water resistivity monitoring system.
8.Air blow+ Hot air dry system.
9.PLC control system, English interface and friendly operation system.
10.304 stainless steel frame structure.
11.SMEMA lines to connect up and down stream equipment.
12.Wash liquid PH value monitoring function.

Item	SC610 SPEC
Net conveyor width	600mm
Net conveyor speed	100~150cm/min
Net conveyor height	900±50mm
Net conveyor direction	Left to Right
Product width size	500mm as max
Product height	100mm as max
Wash liquid tank capacity	120L
DI water capacity	30+60L
Filter precision	1um
DI water consumption	400~800L/H
Air vent amount	30m³/H
System control	PLC
Power/Air supply	380VAC,3P,50/60HZ,90KW/0.5Mpa，200L/Min
Resistivity range	0~18MΩ
Machine size	L3500*W1750*H1650mm
Machine weight	2000KG